SYJ-1610 Air-Bearing Dicing Saw for 6-Inch Wafers
The SYJ-1610 is an air-bearing spindle platform for thin-wafer dicing. A 3000-50000 rpm speed range, camera-assisted alignment and programmable control support laboratory wafer processing with dedicated cooling-water and clean-air services.
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
- Thin-wafer dicing
- Research wafer process development
主な製品特徴
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Air-bearing high-speed spindle
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Camera-assisted alignment with ring and coaxial lighting
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Programmable touchscreen operation
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Wafer and table size | Up to 6-inch wafers; 160 x 160 mm square table |
|---|---|
| Spindle speed | 3000-50000 rpm |
| Blade size | 50.8-60 mm OD; 40 mm ID; 0.035-0.35 mm thickness |
| Maximum cutting depth | 1.5 mm |
| Axis precision | Y single-step accuracy: 0.003 mm/5 mm; Z repeatability: 0.001 mm |
| Electrical supply and power | 220 V AC +/-10%, single-phase; 3 kW |
| Compressed-air requirement | At least 0.6 MPa and 300 L/min; clean, dry, oil-free |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
Plan utilities before installation: cutting water is listed at at least 0.3 MPa and 3 L/min; the air source must be clean, dry and oil-free. Confirm current controller software and the exact blade/flange configuration in the quotation.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
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