SYJ190 Multi-Blade Low-Speed Saw for Wafer Sectioning
Prepare multiple parallel cuts with the SYJ190 multi-blade saw. The 6-inch blade platform combines 50-680 rpm speed control, micrometer positioning and a tilting sample stage for small wafer and material-sectioning work.
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
- Small wafer sectioning
- Parallel material sample preparation
主な製品特徴
-
Multiple-blade mounting capability
-
Tilting and rotating specimen stage
-
Coolant-assisted cutting
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Spindle speed | 50-680 rpm |
|---|---|
| Cutting width and depth | 120 mm width; 10 mm maximum depth |
| Blade size | 6-inch OD x 0.47-inch ID x 0.6 mm thick |
| Sample-stage adjustment | +/-10 degrees tilt; 360 degrees horizontal rotation |
| Electrical supply | 100-220 V AC adapter input; 24 V DC output |
| Rated power | 225 W |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
Confirm blade spacing, fixture geometry and the number of blades for the required pattern. The rated maximum depth is 10 mm; a 6-inch blade diameter does not imply a larger cutting depth.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
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