SYJ-400 CNC Dicing Saw for 4-Inch Wafer and Material Samples
Set programmable cutting paths for small wafers and rectangular specimens with the SYJ-400. Three-axis feed control, a variable-speed spindle and vacuum-chuck mounting support research-scale dicing and material evaluation.
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
- Materials research specimen cutting
- Microelectronics wafer dicing
主な製品特徴
-
Manual or software-programmed operation
-
Adjustable three-axis feed
-
Vacuum-chuck wafer mounting
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Effective cutting range | X 8 in x Y 4 in x Z 1 in depth |
|---|---|
| Maximum spindle speed | 3000 rpm |
| Axis feed rates | X/Y: 1-50 mm/min; Z: 1-20 mm/min |
| Motion resolution and positioning accuracy | 0.0025 mm resolution; 0.01 mm positioning accuracy |
| Blade size | 4-inch diameter; 0.35 mm thickness |
| Electrical configuration | 110 or 220 V AC +/-10%, selected configuration; motor consumption 180 W |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
Positioning specifications describe machine motion and are not a guarantee of kerf width or final part accuracy. Confirm wafer mounting, blade thickness and the coolant recirculation arrangement for the application.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
同カテゴリのその他製品
SYJ-DS100-LD Manual Diamond Scriber for Single-Crystal Wafers
詳細を見る →
SYJ-40-LD Compact 4-Inch Diamond Saw for Manual Sample Cutting
詳細を見る →
SYJ-30 10-Inch Abrasive Sectioning Saw for Laboratory Samples
詳細を見る →
SYJ150 Digital Low-Speed Diamond Saw for Precision Sample Sectioning
詳細を見る →
SYJ160 6-Inch Low-Speed Diamond Saw with Digital Positioning
詳細を見る →
SYJ190 Multi-Blade Low-Speed Saw for Wafer Sectioning
詳細を見る →
SYJ-1000 Variable-Speed Sectioning Saw with Gravity and Manual Feed
詳細を見る →