SYJ-DS100-LD Manual Diamond Scriber for Single-Crystal Wafers
Score thin single-crystal substrates without a motor-driven saw. The SYJ-DS100-LD series combines a diamond scribing tool with spring-adjustable pressure and selectable working areas for small wafer preparation tasks.
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
- Silicon and germanium wafer preparation
- Sapphire, lithium niobate and lithium tantalate substrates
主な製品特徴
-
Spring-adjustable scribing pressure
-
Manual scribing and subsequent substrate splitting
-
Three working-area configurations
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Working area options | 100 x 100, 200 x 200 or 300 x 300 mm |
|---|---|
| Maximum substrate thickness | 1 mm, for single-crystal substrates |
| Pressure adjustment | Spring-loaded, manually adjustable |
| Overall dimensions by size | 210 x 210 x 140; 310 x 310 x 140; 410 x 410 x 140 mm |
| Operation | Manual; no electrical supply required |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
Select the working area to suit the substrate dimensions. This is a manual scriber, not a rotating-blade dicing saw; confirm substrate thickness and the intended separation method before ordering.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
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