Laboratory Cutting and Sectioning Equipment

SYJ190 Multi-Blade Low-Speed Saw for Wafer Sectioning

Name: SYJ190 Multi-Blade Low-Speed Saw for Wafer Sectioning | LabSova
Brand: LabSova
SKU: SYJ190

ModelSYJ190

Prepare multiple parallel cuts with the SYJ190 multi-blade saw. The 6-inch blade platform combines 50-680 rpm speed control, micrometer positioning and a tilting sample stage for small wafer and material-sectioning work.

Spindle speed 50-680 rpm

Cutting width and depth 120 mm width; 10 mm maximum depth

Blade size 6-inch OD x 0.47-inch ID x 0.6 mm thick

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Final configuration confirmed before quotation
Customization and accessories reviewed by application
Export packing and documentation available on request

Direct technical contact

Email [email protected] WhatsApp +86 15038179437 WeChat 195 2233 7956

Typical applications

Small wafer sectioning
Parallel material sample preparation

Equipment features

Key product features

Multiple-blade mounting capability
Tilting and rotating specimen stage
Coolant-assisted cutting

Technical data

Technical specifications

Specifications are organized by system so different equipment types can present the parameters that matter for their application.

Key specifications

Spindle speed	50-680 rpm
Cutting width and depth	120 mm width; 10 mm maximum depth
Blade size	6-inch OD x 0.47-inch ID x 0.6 mm thick
Sample-stage adjustment	+/-10 degrees tilt; 360 degrees horizontal rotation
Electrical supply	100-220 V AC adapter input; 24 V DC output
Rated power	225 W

Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.

Direct technical contact

Email [email protected] WhatsApp +86 15038179437 WeChat 195 2233 7956

Confirm blade spacing, fixture geometry and the number of blades for the required pattern. The rated maximum depth is 10 mm; a 6-inch blade diameter does not imply a larger cutting depth.

Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.

Product inquiry

Request a quotation

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Material, process and target result
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Procurement details can be confirmed before ordering.

For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.

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Related equipment

SYJ190 Multi-Blade Low-Speed Saw for Wafer Sectioning

Key product features

Technical specifications

Key specifications

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