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Laboratory Cutting and Sectioning Equipment

SYJ-40-LD Compact 4-Inch Diamond Saw for Manual Sample Cutting

ModelSYJ-40-LD

Prepare small material blanks before grinding or polishing with the SYJ-40-LD. A 4-inch blade, adjustable spindle speed and manually guided cutting make this compact saw suitable for rough sectioning rather than precision wafer dicing.

Blade size 4-inch diameter; 0.35 mm thickness; 0.5-inch arbor
Spindle speed 400-3250 rpm
Maximum cutting depth 25.4 mm
  • Final configuration confirmed before quotation
  • Customization and accessories reviewed by application
  • Export packing and documentation available on request
Typical applications
  • Crystal and ceramic blank preparation
  • Pre-sectioning before grinding and polishing
Equipment features

Key product features

  • Variable-speed direct-drive spindle

  • Removable housing for cleaning

  • Manual feed for small sample blanks

Technical data

Technical specifications

Specifications are organized by system so different equipment types can present the parameters that matter for their application.

Key specifications

Blade size 4-inch diameter; 0.35 mm thickness; 0.5-inch arbor
Spindle speed 400-3250 rpm
Maximum cutting depth 25.4 mm
Maximum sample width 40 mm, limited by holder opening
Maximum sample loading length 6 inches
Electrical supply and power 110 V AC, 50/60 Hz; 120 W

Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.

Confirm the blade type and sample restraint for the material. A vise is not assumed to be included. The listed supply is 110 V AC; other mains voltages require a suitable confirmed power arrangement.

Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.