SYJ-40-LD Compact 4-Inch Diamond Saw for Manual Sample Cutting
Prepare small material blanks before grinding or polishing with the SYJ-40-LD. A 4-inch blade, adjustable spindle speed and manually guided cutting make this compact saw suitable for rough sectioning rather than precision wafer dicing.
- Configuration finale confirmée avant devis
- Personnalisation et accessoires étudiés selon l’application
- Emballage export et documentation disponibles sur demande
- Crystal and ceramic blank preparation
- Pre-sectioning before grinding and polishing
Principales caractéristiques
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Variable-speed direct-drive spindle
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Removable housing for cleaning
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Manual feed for small sample blanks
Spécifications techniques
Les spécifications sont organisées par système afin de présenter les paramètres pertinents pour chaque équipement.
Key specifications
| Blade size | 4-inch diameter; 0.35 mm thickness; 0.5-inch arbor |
|---|---|
| Spindle speed | 400-3250 rpm |
| Maximum cutting depth | 25.4 mm |
| Maximum sample width | 40 mm, limited by holder opening |
| Maximum sample loading length | 6 inches |
| Electrical supply and power | 110 V AC, 50/60 Hz; 120 W |
Les spécifications peuvent varier selon la configuration. Les données finales dépendent du devis confirmé.
Confirm the blade type and sample restraint for the material. A vise is not assumed to be included. The listed supply is 110 V AC; other mains voltages require a suitable confirmed power arrangement.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
Pour les acheteurs internationaux, la confirmation du devis peut inclure configuration, accessoires, emballage, documents export, photos ou vidéos d’inspection et conditions d’expédition.







