Équipements de meulage et de polissage de laboratoire
Compare benchtop grinders, wafer lapping systems, vibratory polishers and slurry feeders by sample size, plate speed, loading and preparation workflow.
16 produits disponibles
UNIPOL-300 Mini Automatic Grinder and Polisher for 25 mm Samples
Prepare individual metallographic and TEM specimens with a compact 3-inch grinding and polishing platform. UNIPOL-300 combines a moving specimen holder, adjustable spring load and a programmable timer for small-sample laboratory work.
Voir les spécifications →
UNIPOL-800 Benchtop 8-Inch Grinder and Polisher, 500–3000 rpm
UNIPOL-800 is a compact direct-drive grinder and polisher with an 8-inch working plate. Its 500–3000 rpm range supports diamond-disc grinding and subsequent pad polishing on the same benchtop machine.
Voir les spécifications →
EQ-UNIPOL-820 Dual-Platen 8-Inch Grinder and Polisher with Independent Speed Control
Run two preparation stages side by side with EQ-UNIPOL-820. Each 8-inch platen has its own 300 W motor and digital speed control, while magnetic mounting supports changes between abrasive papers and polishing pads.
Voir les spécifications →
UNIPOL-810 Fixed-Yoke 8-Inch Precision Lapping and Polishing Machine
UNIPOL-810 combines an 8-inch lapping plate with a fixed yoke, conditioning ring and flat-sample holder. Adjustable speed up to 600 rpm supports preparation of flat components and mounted laboratory specimens.
Voir les spécifications →
UNIPOL-802 Two-Station 8-Inch Lapping and Polishing Machine
Prepare two specimens with independently rocking workstations on an 8-inch platen. UNIPOL-802 provides a 0–250 rpm plate-speed range, timed operation and a choice of cast-iron or aluminum working plates.
Voir les spécifications →
UNIPOL-900Z / UNIPOL-1200Z Vibratory Polishers for Laboratory Sample Finishing
Choose a vibratory polishing platform by bowl size and available bench space. The UNIPOL-900Z and UNIPOL-1200Z variants offer 231 mm and 304.8 mm working plates respectively for laboratory specimen finishing.
Voir les spécifications →
UNIPOL-1202 12-Inch Wafer Lapping and Polishing Machine with Two Workstations
UNIPOL-1202 processes two wafers up to 4 inches in diameter on a 12-inch platen. Independent rocking stations, timed operation and interchangeable plate materials support laboratory lapping and polishing workflows.
Voir les spécifications →
UNIPOL-1200S Pressure-Controlled 300 mm Automatic Lapping and Polishing Machine
Adjust platen speed, specimen rotation and applied load independently with UNIPOL-1200S. A 300 mm polishing plate and touchscreen controls support multi-sample metallographic preparation and extended polishing runs.
Voir les spécifications →
UNIPOL-1203 Two-Station 300 mm Automatic CMP Polisher with Slurry Feeding
UNIPOL-1203 combines two independently controlled workstations with a 300 mm stainless-steel polishing plate and automatic slurry delivery. Touchscreen settings coordinate platen motion and polishing duration for laboratory CMP work.
Voir les spécifications →
UNIPOL-1502 15-Inch Precision Wafer Polisher for Three 4-Inch Samples
UNIPOL-1502 provides three yokes around a 15-inch platen for batch wafer preparation. It supports three 4-inch specimens or a single larger wafer with the appropriate holder configuration, with speed control up to 125 rpm.
Voir les spécifications →
UNIPOL-1500-S16 Automatic Metallographic Polisher for 16 Samples
Prepare up to 16 mounted specimens per batch using two upper sample carriers over a 380 mm polishing plate. UNIPOL-1500-S16 offers touchscreen settings for load, rotation and polishing time for higher-throughput metallographic workflows.
Voir les spécifications →
UNIPOL-2001 Three-Station 20-Inch Precision Grinder and Polisher
UNIPOL-2001 uses a 508 mm working plate and three independently controlled rocking stations for larger-wafer preparation. A 1.7 kW drive supports grinding and polishing with cast-iron and aluminum plate configurations.
Voir les spécifications →
UNIPOL-1210S Automated Lapping and Polishing System with Sample Conveyor
UNIPOL-1210S integrates lapping, polishing and sample-tray conveyance for an automated preparation workflow. It combines a five-sample holder with adjustable spindle speed, loading and process speeds.
Voir les spécifications →
UNIPOL-1210M Metallographic Preparation System with Hot Mounting and Automatic Polishing
Combine hot mounting, abrasive changes, polishing and ultrasonic cleaning in one automated workflow. UNIPOL-1210M handles up to six samples per mounting cycle and stores up to 16 sets of grinding and polishing consumables.
Voir les spécifications →
EQ-SKZD-4 Four-Channel Slurry Feeder for Laboratory Polishing Machines
Deliver polishing suspension from four separate 600 mL containers with EQ-SKZD-4. Adjustable flow and timing help organize multi-stage polishing without treating the feeder as a standalone polishing machine.
Voir les spécifications →
UNIPOL-1503 Automated 15-Inch Wafer Polisher with Thickness Control
UNIPOL-1503 combines a 15-inch platen, three 4-inch sample stations and Bluetooth-enabled thickness control. A PLC and 10-inch touchscreen coordinate plate rotation and swing motion for automated wafer polishing.
Voir les spécifications →Commencez par le besoin procédé, puis comparez la plage de fonctionnement, la taille de chambre ou de travail, la précision de contrôle, les accessoires, les utilités et les contraintes d’expédition.
- Confirmez le matériau, la taille d’échantillon et le résultat cible.
- Vérifiez la tension, l’espace d’installation et les utilités.
- Demandez les accessoires, pièces de rechange, emballage et documents inclus.