Abastecimiento B2B de equipos de laboratorio Coordinación de proveedores · Aclaración técnica · Soporte de exportación
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16 productos disponibles

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UNIPOL-300 Mini Automatic Grinder and Polisher for 25 mm Samples
UNIPOL-300

UNIPOL-300 Mini Automatic Grinder and Polisher for 25 mm Samples

Prepare individual metallographic and TEM specimens with a compact 3-inch grinding and polishing platform. UNIPOL-300 combines a moving specimen holder, adjustable spring load and a programmable timer for small-sample laboratory work.

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UNIPOL-800 Benchtop 8-Inch Grinder and Polisher, 500–3000 rpm
UNIPOL-800

UNIPOL-800 Benchtop 8-Inch Grinder and Polisher, 500–3000 rpm

UNIPOL-800 is a compact direct-drive grinder and polisher with an 8-inch working plate. Its 500–3000 rpm range supports diamond-disc grinding and subsequent pad polishing on the same benchtop machine.

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EQ-UNIPOL-820 Dual-Platen 8-Inch Grinder and Polisher with Independent Speed Control
EQ-UNIPOL-820

EQ-UNIPOL-820 Dual-Platen 8-Inch Grinder and Polisher with Independent Speed Control

Run two preparation stages side by side with EQ-UNIPOL-820. Each 8-inch platen has its own 300 W motor and digital speed control, while magnetic mounting supports changes between abrasive papers and polishing pads.

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UNIPOL-810 Fixed-Yoke 8-Inch Precision Lapping and Polishing Machine
UNIPOL-810

UNIPOL-810 Fixed-Yoke 8-Inch Precision Lapping and Polishing Machine

UNIPOL-810 combines an 8-inch lapping plate with a fixed yoke, conditioning ring and flat-sample holder. Adjustable speed up to 600 rpm supports preparation of flat components and mounted laboratory specimens.

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UNIPOL-802 Two-Station 8-Inch Lapping and Polishing Machine
UNIPOL-802

UNIPOL-802 Two-Station 8-Inch Lapping and Polishing Machine

Prepare two specimens with independently rocking workstations on an 8-inch platen. UNIPOL-802 provides a 0–250 rpm plate-speed range, timed operation and a choice of cast-iron or aluminum working plates.

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UNIPOL-900Z / UNIPOL-1200Z Vibratory Polishers for Laboratory Sample Finishing
UNIPOL-900Z / UNIPOL-1200Z

UNIPOL-900Z / UNIPOL-1200Z Vibratory Polishers for Laboratory Sample Finishing

Choose a vibratory polishing platform by bowl size and available bench space. The UNIPOL-900Z and UNIPOL-1200Z variants offer 231 mm and 304.8 mm working plates respectively for laboratory specimen finishing.

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UNIPOL-1202 12-Inch Wafer Lapping and Polishing Machine with Two Workstations
UNIPOL-1202

UNIPOL-1202 12-Inch Wafer Lapping and Polishing Machine with Two Workstations

UNIPOL-1202 processes two wafers up to 4 inches in diameter on a 12-inch platen. Independent rocking stations, timed operation and interchangeable plate materials support laboratory lapping and polishing workflows.

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UNIPOL-1200S Pressure-Controlled 300 mm Automatic Lapping and Polishing Machine
UNIPOL-1200S

UNIPOL-1200S Pressure-Controlled 300 mm Automatic Lapping and Polishing Machine

Adjust platen speed, specimen rotation and applied load independently with UNIPOL-1200S. A 300 mm polishing plate and touchscreen controls support multi-sample metallographic preparation and extended polishing runs.

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UNIPOL-1203 Two-Station 300 mm Automatic CMP Polisher with Slurry Feeding
UNIPOL-1203

UNIPOL-1203 Two-Station 300 mm Automatic CMP Polisher with Slurry Feeding

UNIPOL-1203 combines two independently controlled workstations with a 300 mm stainless-steel polishing plate and automatic slurry delivery. Touchscreen settings coordinate platen motion and polishing duration for laboratory CMP work.

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UNIPOL-1502 15-Inch Precision Wafer Polisher for Three 4-Inch Samples
UNIPOL-1502

UNIPOL-1502 15-Inch Precision Wafer Polisher for Three 4-Inch Samples

UNIPOL-1502 provides three yokes around a 15-inch platen for batch wafer preparation. It supports three 4-inch specimens or a single larger wafer with the appropriate holder configuration, with speed control up to 125 rpm.

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UNIPOL-1500-S16 Automatic Metallographic Polisher for 16 Samples
UNIPOL-1500-S16

UNIPOL-1500-S16 Automatic Metallographic Polisher for 16 Samples

Prepare up to 16 mounted specimens per batch using two upper sample carriers over a 380 mm polishing plate. UNIPOL-1500-S16 offers touchscreen settings for load, rotation and polishing time for higher-throughput metallographic workflows.

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UNIPOL-2001 Three-Station 20-Inch Precision Grinder and Polisher
UNIPOL-2001

UNIPOL-2001 Three-Station 20-Inch Precision Grinder and Polisher

UNIPOL-2001 uses a 508 mm working plate and three independently controlled rocking stations for larger-wafer preparation. A 1.7 kW drive supports grinding and polishing with cast-iron and aluminum plate configurations.

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UNIPOL-1210S Automated Lapping and Polishing System with Sample Conveyor
UNIPOL-1210S

UNIPOL-1210S Automated Lapping and Polishing System with Sample Conveyor

UNIPOL-1210S integrates lapping, polishing and sample-tray conveyance for an automated preparation workflow. It combines a five-sample holder with adjustable spindle speed, loading and process speeds.

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UNIPOL-1210M Metallographic Preparation System with Hot Mounting and Automatic Polishing
UNIPOL-1210M

UNIPOL-1210M Metallographic Preparation System with Hot Mounting and Automatic Polishing

Combine hot mounting, abrasive changes, polishing and ultrasonic cleaning in one automated workflow. UNIPOL-1210M handles up to six samples per mounting cycle and stores up to 16 sets of grinding and polishing consumables.

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EQ-SKZD-4 Four-Channel Slurry Feeder for Laboratory Polishing Machines
EQ-SKZD-4

EQ-SKZD-4 Four-Channel Slurry Feeder for Laboratory Polishing Machines

Deliver polishing suspension from four separate 600 mL containers with EQ-SKZD-4. Adjustable flow and timing help organize multi-stage polishing without treating the feeder as a standalone polishing machine.

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UNIPOL-1503 Automated 15-Inch Wafer Polisher with Thickness Control
UNIPOL-1503

UNIPOL-1503 Automated 15-Inch Wafer Polisher with Thickness Control

UNIPOL-1503 combines a 15-inch platen, three 4-inch sample stations and Bluetooth-enabled thickness control. A PLC and 10-inch touchscreen coordinate plate rotation and swing motion for automated wafer polishing.

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