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Thin Film Deposition Equipment

VTC-1RF-SPC Hybrid Magnetron Sputtering and Thermal Evaporation System

ModelVTC-1RF-SPC

A stainless-steel chamber combines a magnetron source and a temperature-controlled evaporation crucible for complementary deposition processes.

Sputtering source options 500 W DC or 300 W RF, 13.56 MHz
Maximum evaporation temperature 1350 °C
Chamber size Ø250 × 360 mm
  • Final configuration confirmed before quotation
  • Customization and accessories reviewed by application
  • Export packing and documentation available on request
Equipment features

Key product features

  • Sputtering source options: 500 W DC or 300 W RF, 13.56 MHz

  • Maximum evaporation temperature: 1350 °C

  • Chamber size: Ø250 × 360 mm

Technical data

Technical specifications

Specifications are organized by system so different equipment types can present the parameters that matter for their application.

Key specifications

Sputtering source options 500 W DC or 300 W RF, 13.56 MHz
Maximum evaporation temperature 1350 °C
Chamber size Ø250 × 360 mm
Sample stage diameter 100 mm
Maximum stage temperature 700 °C
Specified cold base pressure 8 × 10^-6 Torr

Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.

Confirm target materials, substrate dimensions, power sources, vacuum pumps, cooling and gas requirements with LabSova. Optional components and laboratory utilities must be specified separately.