SYJ-DS100-LD Manual Diamond Scriber for Single-Crystal Wafers
Score thin single-crystal substrates without a motor-driven saw. The SYJ-DS100-LD series combines a diamond scribing tool with spring-adjustable pressure and selectable working areas for small wafer preparation tasks.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
- Silicon and germanium wafer preparation
- Sapphire, lithium niobate and lithium tantalate substrates
Key product features
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Spring-adjustable scribing pressure
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Manual scribing and subsequent substrate splitting
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Three working-area configurations
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Working area options | 100 x 100, 200 x 200 or 300 x 300 mm |
|---|---|
| Maximum substrate thickness | 1 mm, for single-crystal substrates |
| Pressure adjustment | Spring-loaded, manually adjustable |
| Overall dimensions by size | 210 x 210 x 140; 310 x 310 x 140; 410 x 410 x 140 mm |
| Operation | Manual; no electrical supply required |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
Select the working area to suit the substrate dimensions. This is a manual scriber, not a rotating-blade dicing saw; confirm substrate thickness and the intended separation method before ordering.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.







