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Laboratory Cutting and Sectioning Equipment

SYJ-DS100-LD Manual Diamond Scriber for Single-Crystal Wafers

ModelSYJ-DS100-LD

Score thin single-crystal substrates without a motor-driven saw. The SYJ-DS100-LD series combines a diamond scribing tool with spring-adjustable pressure and selectable working areas for small wafer preparation tasks.

Working area options 100 x 100, 200 x 200 or 300 x 300 mm
Maximum substrate thickness 1 mm, for single-crystal substrates
Pressure adjustment Spring-loaded, manually adjustable
  • Final configuration confirmed before quotation
  • Customization and accessories reviewed by application
  • Export packing and documentation available on request
Typical applications
  • Silicon and germanium wafer preparation
  • Sapphire, lithium niobate and lithium tantalate substrates
Equipment features

Key product features

  • Spring-adjustable scribing pressure

  • Manual scribing and subsequent substrate splitting

  • Three working-area configurations

Technical data

Technical specifications

Specifications are organized by system so different equipment types can present the parameters that matter for their application.

Key specifications

Working area options 100 x 100, 200 x 200 or 300 x 300 mm
Maximum substrate thickness 1 mm, for single-crystal substrates
Pressure adjustment Spring-loaded, manually adjustable
Overall dimensions by size 210 x 210 x 140; 310 x 310 x 140; 410 x 410 x 140 mm
Operation Manual; no electrical supply required

Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.

Select the working area to suit the substrate dimensions. This is a manual scriber, not a rotating-blade dicing saw; confirm substrate thickness and the intended separation method before ordering.

Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.