SYJ-400 CNC Dicing Saw for 4-Inch Wafer and Material Samples
Set programmable cutting paths for small wafers and rectangular specimens with the SYJ-400. Three-axis feed control, a variable-speed spindle and vacuum-chuck mounting support research-scale dicing and material evaluation.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
- Materials research specimen cutting
- Microelectronics wafer dicing
Key product features
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Manual or software-programmed operation
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Adjustable three-axis feed
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Vacuum-chuck wafer mounting
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Effective cutting range | X 8 in x Y 4 in x Z 1 in depth |
|---|---|
| Maximum spindle speed | 3000 rpm |
| Axis feed rates | X/Y: 1-50 mm/min; Z: 1-20 mm/min |
| Motion resolution and positioning accuracy | 0.0025 mm resolution; 0.01 mm positioning accuracy |
| Blade size | 4-inch diameter; 0.35 mm thickness |
| Electrical configuration | 110 or 220 V AC +/-10%, selected configuration; motor consumption 180 W |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
Positioning specifications describe machine motion and are not a guarantee of kerf width or final part accuracy. Confirm wafer mounting, blade thickness and the coolant recirculation arrangement for the application.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.
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