SYJ-40-LD Compact 4-Inch Diamond Saw for Manual Sample Cutting
Prepare small material blanks before grinding or polishing with the SYJ-40-LD. A 4-inch blade, adjustable spindle speed and manually guided cutting make this compact saw suitable for rough sectioning rather than precision wafer dicing.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
- Crystal and ceramic blank preparation
- Pre-sectioning before grinding and polishing
Key product features
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Variable-speed direct-drive spindle
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Removable housing for cleaning
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Manual feed for small sample blanks
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Blade size | 4-inch diameter; 0.35 mm thickness; 0.5-inch arbor |
|---|---|
| Spindle speed | 400-3250 rpm |
| Maximum cutting depth | 25.4 mm |
| Maximum sample width | 40 mm, limited by holder opening |
| Maximum sample loading length | 6 inches |
| Electrical supply and power | 110 V AC, 50/60 Hz; 120 W |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
Confirm the blade type and sample restraint for the material. A vise is not assumed to be included. The listed supply is 110 V AC; other mains voltages require a suitable confirmed power arrangement.
Images may show optional accessories. Confirm blade, fixtures, electrical configuration and delivered items with LabSova before ordering.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.







