実験室用研削・研磨装置
UNIPOL-1503 Automated 15-Inch Wafer Polisher with Thickness Control
モデルUNIPOL-1503
UNIPOL-1503 combines a 15-inch platen, three 4-inch sample stations and Bluetooth-enabled thickness control. A PLC and 10-inch touchscreen coordinate plate rotation and swing motion for automated wafer polishing.
Plate diameter
15 inches
Plate speed
0–120 rpm
Sample stations
3 stations, each for a 4-inch sample
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
代表的な用途
- Automated wafer polishing
- Thickness-controlled laboratory specimen preparation
設備の特徴
主な製品特徴
-
Three workstations for 4-inch specimens
-
Bluetooth-enabled thickness control
-
PLC and 10-inch touchscreen interface
技術データ
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Plate diameter | 15 inches |
|---|---|
| Plate speed | 0–120 rpm |
| Sample stations | 3 stations, each for a 4-inch sample |
| Control | PLC with 10-inch touchscreen |
| Thickness control | Bluetooth-enabled thickness control |
| Swing frequency | Up to 10 cycles/min |
| Power supply | 208–240 V AC, 50/60 Hz, 10 A; 110 V option on request |
| Shipping dimensions | 1030 x 790 x 1050 mm |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
Confirm thickness-control sensors and slurry equipment in the final configuration. Do not assume optional thickness-checking accessories are included.
Images may show optional accessories. Confirm voltage, holders, consumables and included items in the final quotation.
発注前に調達条件を確認できます。
要件を確認
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
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