実験室用研削・研磨装置
UNIPOL-1202 12-Inch Wafer Lapping and Polishing Machine with Two Workstations
モデルUNIPOL-1202
UNIPOL-1202 processes two wafers up to 4 inches in diameter on a 12-inch platen. Independent rocking stations, timed operation and interchangeable plate materials support laboratory lapping and polishing workflows.
Plate diameter
12 inches
Sample capacity
2 wafers, up to 4-inch diameter each
Plate speed
0–125 rpm
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
代表的な用途
- Wafer lapping and polishing
- Preparation of two flat specimens per run
設備の特徴
主な製品特徴
-
Two independently controlled rocking stations
-
Cast-iron and aluminum lapping plates
-
Digital master-plate speed setting
技術データ
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Plate diameter | 12 inches |
|---|---|
| Sample capacity | 2 wafers, up to 4-inch diameter each |
| Plate speed | 0–125 rpm |
| Plate run-out | Less than 5 µm |
| Rocking frequency | 0–9 cycles/min |
| Sample holder dimensions | 105 mm diameter x 35 mm thickness |
| Timer | 0–99 hours |
| Motor power | 300 W DC motor |
| Power supply | 208–240 V AC, 50/60 Hz; optional 110 V transformer arrangement |
| Listed machine weight | 154 lb |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
Use the holder and ring dimensions to check specimen fit. Slurry feeding and special glovebox-compatible configurations require separate confirmation.
Images may show optional accessories. Confirm voltage, holders, consumables and included items in the final quotation.
発注前に調達条件を確認できます。
要件を確認
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
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