UNIPOL-1203 Two-Station 300 mm Automatic CMP Polisher with Slurry Feeding
UNIPOL-1203 combines two independently controlled workstations with a 300 mm stainless-steel polishing plate and automatic slurry delivery. Touchscreen settings coordinate platen motion and polishing duration for laboratory CMP work.
- 最終構成は見積前に確認
- 用途に応じてカスタムと付属品を確認
- 輸出梱包と書類は必要に応じて対応
- Laboratory chemical-mechanical polishing
- Wafer and crystal substrate surface preparation
主な製品特徴
-
Two individually controlled workstations
-
Automatic slurry feed with adjustable delivery
-
Optional precision fixture for samples up to 100 mm
技術仕様
仕様はシステム別に整理され、設備タイプごとに重要なパラメータを表示します。
Key specifications
| Polishing plate | 300 mm diameter, stainless steel |
|---|---|
| Plate speed | 1–240 rpm |
| Workstations | 2 |
| Holder / conditioning ring | 105 mm holder; 127.5 mm ring diameter |
| Plate run-out | Less than 5 µm |
| Slurry capacity | Approximately 3.8 L |
| Feeder particle-size limit | Less than 40 µm |
| Optional fixture sample limits | 100 mm maximum diameter; 12 mm maximum thickness |
| Power supply | 208–240 V AC, 50 Hz, 450 W |
| Base-machine dimensions | 550 x 700 x 420 mm, excluding optional accessories |
| Net weight | 74 kg |
仕様は構成やカスタム内容により変更される場合があります。最終データは確認済み見積に従います。
The 100 mm sample capability refers to the optional precision fixture. Select a slurry with particle size below the stated feeder limit and confirm material compatibility.
Images may show optional accessories. Confirm voltage, holders, consumables and included items in the final quotation.
海外購入者向けに、構成、付属品、梱包方法、輸出書類、検査写真または動画、出荷条件を見積確認に含められます。
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