UNIPOL-1202 12-Inch Wafer Lapping and Polishing Machine with Two Workstations
UNIPOL-1202 processes two wafers up to 4 inches in diameter on a 12-inch platen. Independent rocking stations, timed operation and interchangeable plate materials support laboratory lapping and polishing workflows.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
- Wafer lapping and polishing
- Preparation of two flat specimens per run
Key product features
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Two independently controlled rocking stations
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Cast-iron and aluminum lapping plates
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Digital master-plate speed setting
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Plate diameter | 12 inches |
|---|---|
| Sample capacity | 2 wafers, up to 4-inch diameter each |
| Plate speed | 0–125 rpm |
| Plate run-out | Less than 5 µm |
| Rocking frequency | 0–9 cycles/min |
| Sample holder dimensions | 105 mm diameter x 35 mm thickness |
| Timer | 0–99 hours |
| Motor power | 300 W DC motor |
| Power supply | 208–240 V AC, 50/60 Hz; optional 110 V transformer arrangement |
| Listed machine weight | 154 lb |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
Use the holder and ring dimensions to check specimen fit. Slurry feeding and special glovebox-compatible configurations require separate confirmation.
Images may show optional accessories. Confirm voltage, holders, consumables and included items in the final quotation.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.
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