UNIPOL-1503 Automated 15-Inch Wafer Polisher with Thickness Control
UNIPOL-1503 combines a 15-inch platen, three 4-inch sample stations and Bluetooth-enabled thickness control. A PLC and 10-inch touchscreen coordinate plate rotation and swing motion for automated wafer polishing.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
- Automated wafer polishing
- Thickness-controlled laboratory specimen preparation
Key product features
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Three workstations for 4-inch specimens
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Bluetooth-enabled thickness control
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PLC and 10-inch touchscreen interface
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Plate diameter | 15 inches |
|---|---|
| Plate speed | 0–120 rpm |
| Sample stations | 3 stations, each for a 4-inch sample |
| Control | PLC with 10-inch touchscreen |
| Thickness control | Bluetooth-enabled thickness control |
| Swing frequency | Up to 10 cycles/min |
| Power supply | 208–240 V AC, 50/60 Hz, 10 A; 110 V option on request |
| Shipping dimensions | 1030 x 790 x 1050 mm |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
Confirm thickness-control sensors and slurry equipment in the final configuration. Do not assume optional thickness-checking accessories are included.
Images may show optional accessories. Confirm voltage, holders, consumables and included items in the final quotation.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.
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