OTF-1200X-RTP-II Dual-Zone CSS and Rapid Thermal Processing Furnace
Independently controlled upper and lower infrared heaters support close-spaced sublimation and thermal processing of 3-inch substrates.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
Key product features
-
Substrate diameter: 3 in
-
Maximum heater temperature: 650 °C
-
Heater spacing: 10–50 mm
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Substrate diameter | 3 in |
|---|---|
| Maximum heater temperature | 650 °C |
| Heater spacing | 10–50 mm |
| Temperature program | 2 controllers; 30 segments each |
| Total heating power | 2200 W |
| Overall dimensions | 850 × 745 × 1615 mm |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
Confirm the evaporation material, source compatibility, substrate dimensions, vacuum level and electrical configuration with LabSova. Equipment and accessories are supplied according to the agreed configuration.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.







