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Thin Film Deposition Equipment

OTF-1200X-RTP-II Dual-Zone CSS and Rapid Thermal Processing Furnace

ModelOTF-1200X-RTP-II

Independently controlled upper and lower infrared heaters support close-spaced sublimation and thermal processing of 3-inch substrates.

Substrate diameter 3 in
Maximum heater temperature 650 °C
Heater spacing 10–50 mm
  • Final configuration confirmed before quotation
  • Customization and accessories reviewed by application
  • Export packing and documentation available on request
Equipment features

Key product features

  • Substrate diameter: 3 in

  • Maximum heater temperature: 650 °C

  • Heater spacing: 10–50 mm

Technical data

Technical specifications

Specifications are organized by system so different equipment types can present the parameters that matter for their application.

Key specifications

Substrate diameter 3 in
Maximum heater temperature 650 °C
Heater spacing 10–50 mm
Temperature program 2 controllers; 30 segments each
Total heating power 2200 W
Overall dimensions 850 × 745 × 1615 mm

Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.

Confirm the evaporation material, source compatibility, substrate dimensions, vacuum level and electrical configuration with LabSova. Equipment and accessories are supplied according to the agreed configuration.