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Thin Film Deposition Equipment

HVMSS-SPC-1-LD Tilting 1-Inch RF/DC Magnetron Sputtering Source

ModelHVMSS-SPC-1-LD

A compact source component with adjustable incidence angle, suitable for integration with an external RF or DC supply and water cooling.

Target diameter 25.4 mm
Maximum target thickness 3 mm
Maximum input power 250 W DC; 100 W RF
  • Final configuration confirmed before quotation
  • Customization and accessories reviewed by application
  • Export packing and documentation available on request
Equipment features

Key product features

  • Target diameter: 25.4 mm

  • Maximum target thickness: 3 mm

  • Maximum input power: 250 W DC; 100 W RF

Technical data

Technical specifications

Specifications are organized by system so different equipment types can present the parameters that matter for their application.

Key specifications

Target diameter 25.4 mm
Maximum target thickness 3 mm
Maximum input power 250 W DC; 100 W RF
Head tilt ±45°
Operating voltage 200–1000 V
Operating pressure 1 mTorr–1 Torr

Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.

Confirm target materials, substrate dimensions, power sources, vacuum pumps, cooling and gas requirements with LabSova. Optional components and laboratory utilities must be specified separately.