UNIPOL-1203 Two-Station 300 mm Automatic CMP Polisher with Slurry Feeding
UNIPOL-1203 combines two independently controlled workstations with a 300 mm stainless-steel polishing plate and automatic slurry delivery. Touchscreen settings coordinate platen motion and polishing duration for laboratory CMP work.
- Final configuration confirmed before quotation
- Customization and accessories reviewed by application
- Export packing and documentation available on request
- Laboratory chemical-mechanical polishing
- Wafer and crystal substrate surface preparation
Key product features
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Two individually controlled workstations
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Automatic slurry feed with adjustable delivery
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Optional precision fixture for samples up to 100 mm
Technical specifications
Specifications are organized by system so different equipment types can present the parameters that matter for their application.
Key specifications
| Polishing plate | 300 mm diameter, stainless steel |
|---|---|
| Plate speed | 1–240 rpm |
| Workstations | 2 |
| Holder / conditioning ring | 105 mm holder; 127.5 mm ring diameter |
| Plate run-out | Less than 5 µm |
| Slurry capacity | Approximately 3.8 L |
| Feeder particle-size limit | Less than 40 µm |
| Optional fixture sample limits | 100 mm maximum diameter; 12 mm maximum thickness |
| Power supply | 208–240 V AC, 50 Hz, 450 W |
| Base-machine dimensions | 550 x 700 x 420 mm, excluding optional accessories |
| Net weight | 74 kg |
Specifications may change with configuration and customization. Final data is subject to the confirmed quotation.
The 100 mm sample capability refers to the optional precision fixture. Select a slurry with particle size below the stated feeder limit and confirm material compatibility.
Images may show optional accessories. Confirm voltage, holders, consumables and included items in the final quotation.
For international buyers, quotation confirmation can include configuration, accessories, packing method, export documents, inspection photos or videos and shipping terms.
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