Trenn- und Schneidgeräte für das Labor
Compare laboratory diamond saws, abrasive cutters, wafer dicing systems, core drills and battery-case cutters by sample size, spindle speed, feed control and utility requirements.
15 verfügbare Produkte
SYJ-DS100-LD Manual Diamond Scriber for Single-Crystal Wafers
Score thin single-crystal substrates without a motor-driven saw. The SYJ-DS100-LD series combines a diamond scribing tool with spring-adjustable pressure and selectable working areas for small wafer preparation tasks.
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SYJ-40-LD Compact 4-Inch Diamond Saw for Manual Sample Cutting
Prepare small material blanks before grinding or polishing with the SYJ-40-LD. A 4-inch blade, adjustable spindle speed and manually guided cutting make this compact saw suitable for rough sectioning rather than precision wafer dicing.
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SYJ-30 10-Inch Abrasive Sectioning Saw for Laboratory Samples
Section small metallographic blanks with the SYJ-30 wet abrasive saw. Its 1.1 kW motor drives a 10-inch cutting wheel at a fixed 2800 rpm, with a rated cutting section of 30 x 30 mm and a quick-clamping vise.
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SYJ150 Digital Low-Speed Diamond Saw for Precision Sample Sectioning
Control sample sectioning at up to 600 rpm with the SYJ150 low-speed saw. A digital micrometer sets lateral sample position, while the 4-inch blade arrangement offers a listed maximum cutting depth of 32.5 mm.
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SYJ160 6-Inch Low-Speed Diamond Saw with Digital Positioning
The SYJ160 extends low-speed laboratory sectioning to a maximum 6-inch blade and a listed 50 mm cutting depth. Adjustable speed and digital micrometer positioning help set up controlled cuts in small research specimens.
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SYJ190 Multi-Blade Low-Speed Saw for Wafer Sectioning
Prepare multiple parallel cuts with the SYJ190 multi-blade saw. The 6-inch blade platform combines 50-680 rpm speed control, micrometer positioning and a tilting sample stage for small wafer and material-sectioning work.
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SYJ-1000 Variable-Speed Sectioning Saw with Gravity and Manual Feed
Switch between gravity-fed sectioning and manual rough cutting with the SYJ-1000. Its 4- to 8-inch blade options cover different specimen depths, while a digital micrometer and adjustable vise help set slice position and orientation.
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SYJ-400 CNC Dicing Saw for 4-Inch Wafer and Material Samples
Set programmable cutting paths for small wafers and rectangular specimens with the SYJ-400. Three-axis feed control, a variable-speed spindle and vacuum-chuck mounting support research-scale dicing and material evaluation.
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SYJ50 Wet Abrasive Cut-Off Saw for 50 mm Metallographic Samples
Prepare metallographic cross sections with the SYJ50, also identified as SYJ-50. A 1.5 kW spindle, 10-inch wheel and dual clamping arrangement support wet cutting of specimens up to the listed 50 mm diameter capacity.
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SYJ-200 Programmable Sectioning Saw with Automatic X-Y Feed
Use programmable X-Y movement for repeated sample sections with the SYJ-200. A touchscreen controls manual or automatic operation, while the 300-3500 rpm spindle accepts 6- to 8-inch blades for different sectioning requirements.
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SYJ800 CNC Wafer Dicing Saw with Programmable Rotating Stage
Combine X-Y cutting paths with a motorized rotating stage on the SYJ800. The 8 x 8 inch dicing area and selectable 4- or 6-inch blade configurations allow laboratories to match the cutting setup to the specimen and required depth.
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SYJ-30QY CNC Diamond Core Drill for Cylindrical Material Samples
Extract cylindrical specimens from bulk material using the SYJ-30QY hollow-core drilling system. CNC-controlled vertical feed, manually positioned X-Y axes and selectable diamond core tools support small sample preparation for materials analysis.
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SYJ-1610 Air-Bearing Dicing Saw for 6-Inch Wafers
The SYJ-1610 is an air-bearing spindle platform for thin-wafer dicing. A 3000-50000 rpm speed range, camera-assisted alignment and programmable control support laboratory wafer processing with dedicated cooling-water and clean-air services.
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MSK-530 Compact Cutter for Cylindrical Battery Case Disassembly
Open cylindrical battery cases for laboratory examination with the MSK-530 manual-feed cutter. Separate case rotation and cutting drives, a micrometer adjustment and a protective cover support controlled disassembly work by trained laboratory personnel.
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MSK-4680 Variable-Speed Cylindrical Battery Case Cutter
Match cutting and chuck speeds to the case-opening task with the MSK-4680. Interchangeable holders and 2- or 3-inch cutting-disc options serve cylindrical-cell research workflows, with a protective enclosure and separate control box.
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